Basic principle
In the laser soldering process the laser beam from a diode laser is directed precisely at the required contact point. This laser beam is mainly absorbed by the solder, which leads to a fast and non-destructive solder joint. The very short heating and cooling times give rise to a fine-grained structure of the inter-metallic connection. For this reason, this precise and contactless process produces the best quality of solder joint.
The process settings, such as laser power profile, process time as well as the geometry of the laser beam, can be precisely programmed and controlled, resulting in consistent soldering results.
THT (through-hole technology) and SMT (surface mounted technology ) components can be soldered with laser soldering. Solder wire, solder paste or preforms can be used as the soldering agent.
The used of the laser beam as the heat source in soft soldering offers major advantages for selective solder processes. Single contacts or complete components can be soldered without fear of thermal damage to the components, substrates or the surroundings.
Advantages:
- Contactless, locally limited application of energy
- Precise, controllable process parameters
- Low thermal stress
- High quality of the solder joint
- Flexible and easily adapted
- Low maintenance
- No tool wear
